Manufacturing Processes for Electronic Systems

Manufacturing Processes for Electronic Systems

Printed Circuit Board (PCB) fabrication

  • Printed Circuit Board (PCB) fabrication is a crucial step in the production of electronic systems.
  • PCB Design involves layout of the components and planning the routing of electrical connections. Software such as CAD can aid in this process.
  • Etching is the process of using acidic solutions to remove excess copper from a PCB, leaving behind the desired conductive paths.
  • Drilling is carried out to create holes in the PCB for through-hole constructed components or mounting hardware.
  • Soldering is used to secure components to the PCB and to create a strong electrical connection.

Surface Mount Technology (SMT)

  • Surface Mount Technology (SMT) involves the placement of components directly onto the surface of a PCB, rather than using through-hole connections.
  • Precision machines, known as pick-and-place machines, are usually used to place components accurately.
  • SMT allows for smaller components and a higher density of interconnections, leading to miniaturisation of electronics.

Through-hole Technology

  • Through-hole Technology involves inserting a component pin through a hole in the PCB and then soldering it to a conductive pad.
  • This technology is typically used for large or high-power components, and it offers stronger mechanical connections.
  • However, it is generally a slower and more costly process compared to SMT.

Hand Assembly

  • Hand Assembly is a process of constructing PCBs by manually soldering components onto a PCB.
  • This method is typically used in low volume production, prototyping, or for components not suitable for machine placement.
  • Skilled technicians are required for this process, as it requires a understanding of electronic components and the ability to make precise movements.

Quality Control

  • Quality Control is a series of checks to ensure the final electronic system meets the desired design specifications.
  • Visual inspections can be conducted to evaluate solder quality, component placement, and to detect any missing or incorrect parts.
  • Automated Optical Inspection (AOI) systems can be used to scan the PCBs and compare them to a digital image.
  • Testing could involve functional tests which power the system and check for correct operation.